Composite aluminum foil is centered on the evaporation process.
Evaporation process through high temperature melting metal materials, evaporation to the base film to achieve copper/aluminum plating, compared with magnetron sputtering faster, more efficient, but due to high temperature is easy to make the base film deformation, in the process of copper plating less use; aluminum melting point is much lower than copper, so the temperature of evaporation plating can be controlled at a relatively low level, can reduce the high temperature to make the base film deformation and other problems, so evaporation plating is more suitable for the preparation of composite aluminum foil.
Composite aluminum foil can be prepared by dry process only without using wet process such as water plating.
Preparation of composite copper foil using water plating process is mainly to improve the overall production efficiency and reduce the risk of base film breakdown; because the base film thickness of composite aluminum foil is thicker, at about 4.5-6μm (copper foil is 3-4.5μm base film), the risk of breakdown and fracture during the preparation process is reduced, and the use of steam plating process efficiency has been improved, so there is no need for water plating to do the thickening treatment to a certain extent to reduce the impact of the wet and dry process conversion process. The impact of wet/dry process conversion on yield has been reduced to a certain extent.
