The evaporation process melts the metal material at high temperature and evaporates it onto the base film to achieve copper/aluminum plating. Compared with magnetron sputtering, the evaporation process is faster and more efficient. However, because the high temperature easily deforms the base film, it is more difficult during the copper plating process. Use sparingly; the melting point of aluminum is much lower than that of copper, so the evaporation temperature can be controlled at a relatively lower level, which can reduce the occurrence of problems such as deformation of the base film caused by high temperatures. Therefore, evaporation is more suitable for the preparation of composite aluminum foil.
The water electroplating process is used to prepare composite copper foil mainly to improve the overall production efficiency and reduce the risk of base film breakdown; because the thickness of the composite aluminum foil base film is thicker, about 4.5-6μm (copper foil is a 3-4.5μm base film), During the preparation process, risks such as breakdown and fracture are reduced, and the efficiency of the evaporation process is also improved. Therefore, there is no need to use the water electroplating process for thickening, which reduces the impact of the dry-wet process conversion process on the yield to a certain extent.
